unfortionatly fhe reason am doing this is because a virus fried my mobo,so i didn't have time to really study the upgrade I'am doing. What Iam doing is going from a socket A Sempron 2800 to a socket 754 Sempron 2800 64.
My questions.
1. I have CoolMaster thermal paste, I know to clean the paste off the heat sink but do I put a layer on the whole back of the proccesor(Iam pretty sure this is yes just makeing sure)
2. I want to use the proccesor fan from my old heat sink on the new one (its lighted) is there any reason it would be not be powerful enough to cool the new proccesor.
3.Now I don't know if this question is appropriet to ask here. But I have XP sp1 and the last rebuild as soon as i went online i would get a virus because i dd not have sp2 which was the first thing i was going online to get( the way i fixed it is now not a option, as the friend whose Hi speed connection i used moved and it was his firewall that kept said virus from infecting machine) is there another way around this, as I remember there was no way to burn to cd from Win update update.
any help with these questions would be much appritiated.

Sorry for the delayed response:

1. Usually you just need a tiny bit of paste. Artic Silver advises the size of an uncooked rice grain:

http://www.arcticsilver.com/instructions.htm

2. If the mounting holes fit I would think it would be OK. You might want to verify the RPM of both and or if they are both heat variable.

3. Either download SP2 to disk or slipstream an XP SP2 CD:

http://www.msfn.org/articles.php?act...showarticle=49